SUSS MicroTec SE has announced its entry into the wafer-level cleaning market with the launch of its GreenTec Solutions product line and the first system, the GT200. The move expands the company's technology portfolio into a market that currently represents an addressable opportunity of approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and growing semiconductor demand from AI and high-performance computing applications. The launch marks a significant strategic step for SUSS, which is known for its photomask processing equipment, as it leverages existing expertise to tap into a new growth area.
At the core of GreenTec Solutions is a hybrid cleaning approach that combines the proven TurbulenStrip™ and CrustBuster™ technologies from SUSS's Photomask Solutions segment. TurbulenStrip™ incorporates lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ utilizes patented in-situ UV technology to break down organic materials directly at the wafer surface in a single-wafer process chamber. This combination enables highly efficient residue removal and process stability while reducing chemical consumption, supporting customers' sustainability targets, and lowering overall cost-of-ownership. The GreenTec Solutions line eliminates the need for hazardous acids or organic solvents, addressing the semiconductor industry's growing environmental, social, and governance (ESG) needs.
The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, power device, and CMOS applications. It consolidates photoresist removal, surface activation, and final cleaning in one configurable platform, helping fabs reduce tool fragmentation, simplify process flows, and improve operational efficiency. SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption and de-risk technology transfers. More information about the GT200 is available at https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.
The company has a clear roadmap toward high-volume manufacturing (HVM). Following the GT200, SUSS will expand its portfolio with a dedicated 300 mm HVM platform in 2027, pulling in the launch due to strong customer interest, and a 200 mm HVM platform in 2028. This provides customers with a clear migration path from evaluation to full-scale production. The scalable approach is part of SUSS's Ambition 2030 strategy, as explained by CEO Burkhardt Frick: "GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy. By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio." Yuta Nagai, Senior Vice President Photomask Solutions, added, "The GreenTec Solutions product line represents our vision for the next generation of semiconductor manufacturing - where sustainability and process excellence go hand in hand."
The entry into wafer cleaning positions SUSS to capitalize on the increasing demand for advanced semiconductor devices, particularly as AI and high-performance computing drive innovation. By offering a sustainable alternative to traditional cleaning methods, SUSS differentiates itself in a competitive market and supports the industry's shift toward greener manufacturing practices. The company's established expertise in photomask processing provides a strong foundation for this expansion, and the modular, standardized design of GreenTec platforms facilitates scalability. As the semiconductor industry continues to evolve, SUSS's move could set new standards for efficiency and environmental responsibility. For more details about SUSS, visit www.suss.com. The original release is available on www.newmediawire.com.
